AD1-10S - ChipQuik Thermoset Chip Glue (Red) - 10cc syringe
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs).
Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two sided surface mount reflow without larger chips/ICs coming loose.
Curing Time:
- 90 to 120 seconds at 150+ Celsius
- Designed to cure at leaded and lead free reflow temperatures.
Size: 10g / 10cc syringe