Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4

TS391SNL - ChipQuik Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (15g syringe)

Description
Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 5cc syringe 15g w/plunger & tip.
Revolutionary Formula: No Refrigeration Required!

Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217-220C (423-428F)
Size: 5cc/15g syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.